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LTC3529 1.5A, 1.5MHz Step-Up DC/DC Converter in 2mm x 3mm DFN FEATURES
n n n n n n n n n n n n n
DESCRIPTION
The LTC(R)3529 is a 5V output, synchronous, fixed frequency step-up DC/DC converter optimized for USB On-The-Go (OTG) hosting applications. This compact USB OTG 5V VBUS converter features a 1.5MHz switching frequency, internal compensation and a tiny 2mm x 3mm DFN package. The LTC3529 can operate from input voltages as low as 1.8V. USB OTG-specific features include a fault flag with 22ms deglitching to indicate when the bus is overloaded, output disconnect and short-circuit protection. Following a fault, the LTC3529 can be programmed to either latchoff or restart after a time-out duration. Additional features include a <1A shutdown mode, soft-start, inrush current limiting and thermal overload protection. Anti-ring circuitry reduces EMI during low power operation. The LTC3529 is offered in an 8-lead 2mm x 3mm x 0.75mm DFN package.
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents including 6404251, 6166527.
Compact Solution for 5V USB On-The-Go VBUS Power 5V at 500mA from Single Li-Ion Cell Automatic Fault Detection High Efficiency: Up to 95% VIN Range: 1.8V to 5.25V Fixed 5V Output Short-Circuit Protection 1.5MHz Low Noise, Fixed Frequency PWM Inrush Current Limiting and Internal Soft-Start Output Disconnect <1A Quiescent Current in Shutdown VIN > VOUT Operation 8-Lead, 2mm x 3mm DFN Package
APPLICATIONS
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Personal Media Players Digital Video Cameras Digital Multimedia Broadcast Tuners Digital Cameras Smart Phones
TYPICAL APPLICATION
Li-Ion Battery to 5V Synchronous Boost Converter
4.7H 2.5V TO 4.2V 100 90
Efficiency vs Load Current
0.9 0.8 EFFICIENCY 0.7 POWER LOSS (W) 0.6 0.5 0.4 0.3 0.2 POWER LOSS 1 10 100 LOAD CURRENT (mA) 0.1 0 1000
3529 TA01b
+
Li-Ion
3.3F VIN 370
80 LTC3529 EFFICIENCY (%) SW 70 60 50 40 30 20 10 0
FAULT SNSGND AUTO-RESTART OFF ON RST VOUT COUT 10F OFF ON SHDN PGND
3529 TA01a
VOUT 5V 500mA
VIN = 3.6V INDUCTOR = 4.7H, COOPER BUSSMANN SD25-4R7
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LTC3529 ABSOLUTE MAXIMUM RATINGS
(Note 1)
PIN CONFIGURATION
TOP VIEW VOUT 1 SW 2 SHDN 3 PGND 4 9 8 VIN 7 RST 6 SNSGND 5 FAULT
VIN, VOUT Voltage ............................................-0.3 to 6V SHDN, RST, FAULT Voltage..............................-0.3 to 6V SW Voltage DC...............................................................-0.3 to 6V Pulsed <100ns ............................................ -1V to 7V Operating Temperature Range (Note 2).... -40C to 85C Maximum Junction Temperature (Note 3)............. 125C Storage Temperature Range................... -65C to 125C
DCB PACKAGE 8-LEAD (2mm 3mm) PLASTIC DFN TJMAX = 125C, JA = 64C/W EXPOSED PAD (PIN 9) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH LTC3529EDCB#PBF TAPE AND REEL LTC3529EDCB#TRPBF PART MARKING LCTZ PACKAGE DESCRIPTION 8-Lead (2mm x 3mm) Plastic DFN TEMPERATURE RANGE -40C to 85C Consult LTC Marketing for parts specified with wider operating temperature ranges. Consult LTC Marketing for information on non-standard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
ELECTRICAL CHARACTERISTICS
PARAMETER Input Voltage Range Output Voltage Quiescent Current - Shutdown NMOS Switch Leakage Current PMOS Switch Leakage Current NMOS Switch On Resistance PMOS Switch On Resistance NMOS Current Limit Current Limit Delay Time to Output Maximum Duty Cycle Minimum Duty Cycle Switching Frequency SHDN, RST Input High Voltage SHDN, RST Input Low Voltage SHDN, RST Input Current Soft-Start Time Line Regulation (Note 4) (Note 5)
The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VIN = 3.6V, VOUT = 5V unless otherwise noted.
CONDITIONS
l
MIN 1.8 4.85
TYP 5 0.01 0.3 0.3 0.09 0.12
MAX 5.25 5.15 1 15 15
UNITS V V A A A A ns %
VSHDN = 0V, VOUT = 0V VSW = 5V VSW = 0V, VOUT = 5V
l l
l l l l l l l
1.5 40 80 1.2 1 0.35 0.01 2 0.03 1 87 0 1.5 1.8
VOUT = 4.5V VOUT = 5.5V
% MHz V V A ms %/V
VSHDN, VBURST, VRST = 5.5V VIN = 1.8V to 5.25V
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LTC3529 ELECTRICAL CHARACTERISTICS
PARAMETER FAULT Delay Time FAULT Output Low Voltage FAULT Leakage Current IFAULT = 5mA VFAULT = 5.5V
The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VIN = 3.6V, VOUT = 5V unless otherwise noted.
CONDITIONS MIN 12 TYP 22 60 10 MAX 35 UNITS ms mV A
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LTC3529 is guaranteed to meet performance specifications from 0C to 85C. Specifications over the -40C to 85C operating temperature range are assured by design, characterization and correlation with statistical process controls.
Note 3: This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed 125C when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may impair device reliability. Note 4: Current measurements are performed when the LTC3529 is not switching. The current limit values in operation will be somewhat higher due to the propagation delay of the comparators. Note 5: Specification is guaranteed by design and not 100% tested in production.
TYPICAL PERFORMANCE CHARACTERISTICS
2 Alkaline Cells to 5V Efficiency
100 90 80 EFFICIENCY (%) 70 60 50 40 30 20 10 0 1 10 100 LOAD CURRENT (mA) POWER LOSS VIN = 3V 0 1000
3529 G01
Li-Ion Battery to 5V Efficiency
100 0.7 0.6 POWER LOSS (W) EFFICIENCY (%) 0.5 0.4 0.3 90 80 70 60 50 40 30 20 0.1 10 0 1 10 100 LOAD CURRENT (mA) POWER LOSS 0.3 0.2 0.1 0 1000
3529 G02
VIN = 3V EFFICIENCY VIN = 1.8V
VIN = 4.1V VIN = 3.6V VIN = 3V EFFICIENCY
0.7 0.6 0.5 0.4 POWER LOSS (W)
VIN = 1.8V
0.2
COUT = 10F INDUCTOR = 4.7H, COOPER BUSSMANN SD25-4R7
COUT = 10F INDUCTOR = 4.7H, COOPER BUSSMANN SD25-4R7
Soft-Start Waveforms
VOUT 5V/DIV IL 200mA/DIV SHDN 5V/DIV 2ms/DIV VIN = 3.6V VOUT = 5V COUT = 10F L = 2.2H
3529 G03
Load Transient Response
VOUT Ripple
VOUT 200mV/DIV VOUT 5mV/DIV 200s/DIV VIN = 3.6V VOUT = 5V COUT = 10F L = 2.2H
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IL 500mA/DIV
1s/DIV VIN = 3.6V COUT = 10F L = 4.7H ILOAD = 200mA
3529 G05
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LTC3529 TYPICAL PERFORMANCE CHARACTERISTICS
Current Limit vs Temperature
1.90 1.85 CHANGE FROM 25C (%) 1.80 CURRENT LIMIT (A) 1.75 1.70 1.65 1.60 1.55 1.50 1.45 1.40 -45 -25 -5 15 35 55 75 TEMPERATURE (C) 95 115
3529 G06
Output Voltage Change vs Temperature
1.0 0.8 0.6 0.4 IOUT (mA) 0.2 0 -0.2 -0.4 -0.6 -0.8 -1.0 -50 0 50 100 TEMPERATURE (C) 150
3529 G07
Maximum Output Current vs VIN
1600 1400 1200 1000 800 600 400 200 0 1.5 2.0 2.5 3.0 3.5 VIN (V) 4.0 4.5 5.0 L = 4.7H
3529 G08
SW Pin Anti-Ringing
10 IL 25mA/DIV NORMALIZED TO 25C (%) 8
Switching Frequency Variation vs Temperature
18 16 QUIESCENT CURRENT (mA) 14 12 10 8 6 4 2 90 110
No-Load Input Current vs VIN
6 4 2 0 -2 -4 -6 -8
SW 2V/DIV
1s/DIV VIN = 3.6V COUT = 10F L = 4.7H
3529 G09
-10 -50 -30 -10 10 30 50 70 TEMPERATURE (C)
0 1.5
2.5
3.5 VIN (V)
4.5
5.5
3529 G11
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RDS(ON) vs Temperature
160 140 120 100 NMOS 80 60 40 20 0 -50 -25 0 25 50 75 TEMPERATURE (C) 100 125 VOUT CHANGE (%) RDS(ON) (m) PMOS 0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5
Load Regulation
VIN = 3.3V L = 4.7H
0
100
200 300 ILOAD (mA)
400
500
3529 G13
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LTC3529 PIN FUNCTIONS
VOUT (Pin 1): Converter Output, Voltage Sense Input and Drain of the Internal Synchronous Rectifier MOSFET. Driver bias is derived from VOUT. PCB trace length from VOUT to the output filter capacitor(s) should be as short and wide as possible. SW (Pin 2): Switch Node. This node connects to one side of the inductor. Keep PCB traces as short and wide as possible to reduce EMI and voltage overshoot. If the inductor current falls to zero, or SHDN is low, an internal 100 anti-ringing switch is connected between SW and VIN to minimize EMI. SHDN (Pin 3): Active-Low Shutdown Input. Forcing this pin above 1V enables the converter. Forcing this pin below 0.35V disables the converter. Do not float this pin. PGND (Pin 4): High Current Ground Connection. The PCB trace connecting this pin to ground should be as short and as wide as possible. FAULT (Pin 5): Open-Drain Fault Indicator Output. Pulls low when an overcurrent condition exists for more than 22ms. SNSGND (Pin 6): This pin must be connected to ground. RST (Pin 7): Logic Input to Select Automatic Restart or Latchoff Following a Fault Shutdown. * RST = High: Auto-reset mode. In this mode, the LTC3529 will automatically attempt to restart 22ms (typically) after a fault shutdown. * RST = Low: Latchoff mode. In this mode, the LTC3529 will latch off for a fault shutdown. The IC will not restart until the SHDN pin is toggled or the supply voltage is cycled. VIN (Pin 8): Input Supply Pin. Exposed Pad (Pin 9): Small Signal Ground. This is the ground reference for the internal circuitry of the LTC3529 and must be connected directly to ground.
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LTC3529 BLOCK DIAGRAM
L1 4.7H VIN 1.8V TO 5.25V
+ -
CIN 3.3F
8
VIN
3
SHDN
2
SW VIN
BULK CONTROL SIGNALS VOUT, 5V COUT 10F
ANTI-RING VOUT 6 SNSGND CLOCK PWM LOGIC AND DRIVERS
1
+
CURRENT SENSE
IZERO COMP
-
5 FAULT
FAULT OR THERMAL SHUTDOWN
REFERENCE
1.25V
22ms FAULT TIMER
THERMAL SD
PWM COMP
SOFT-START
R1 1.875M
+
-
ILIM COMP
SD
GM ERROR AMPLIFIER
-
+
+ +
OSCILLATOR 2A
RC C2 CC
7
RST
4
PGND
OPERATION
The LTC3529 is a 1.5MHz synchronous boost converter in an 8-lead 2mm x 3mm DFN package. The device operates with an input voltage as low as 1.8V and features fixedfrequency current-mode PWM control for exceptional line and load regulation. Internal MOSFET switches with low RDS(ON) and low gate charge enable the device to maintain high efficiency over a wide range of load current. PWM Operation The LTC3529 operates in a fixed-frequency PWM mode using current-mode control at all load currents. At very
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light loads, the LTC3529 will exhibit pulse-skipping operation. Soft-Start The LTC3529 provides soft-start by ramping the inductor current limit from zero to its peak value in approximately 2ms. The internal soft-start capacitor is discharged in the event of a fault, thermal shutdown or when the IC is disabled via the SHDN pin.
6
- +
1.25V R2 625k 9 GND (BP)
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LTC3529 OPERATION
Oscillator An internal oscillator sets the switching frequency to 1.5MHz. Shutdown The LTC3529 is shut down by pulling the SHDN pin below 0.35V, and activated by pulling the SHDN pin above 1V. Note that SHDN can be driven above VIN or VOUT, as long as it is limited to less than the absolute maximum rating. Error Amplifier The error amplifier is a transconductance amplifier with an internal compensation network. Internal clamps limit the minimum and maximum error amplifier output voltage to improve the large-signal transient response. Current Sensing Lossless current sensing converts the peak current signal of the N-channel MOSFET switch into a voltage that is summed with the internal slope compensation. The summed signal is compared to the error amplifier output to provide a peak current control command for the PWM. Peak switch current is limited to approximately 2A independent of input or output voltage. Current Limit The current limit comparator shuts off the N-channel MOSFET switch when the current limit threshold is reached. The current limit comparator delay time to output is typically 40ns. Fault Detection To prevent the device from providing power to a shorted output, the switch current is monitored to detect an overcurrent condition. In the event that the switch current reaches the current limit for longer than 22ms, the fault flag is asserted (FAULT pulls low) and the device is shut down. If the auto-restart option is enabled (RST high), the device will automatically attempt to restart every 22ms until the short is removed. If auto-restart is disabled (RST low), the IC will remain shut down until being manually restarted by toggling SHDN or cycling the input voltage. A soft-start sequence is initiated when the device restarts. If output short circuits are common in the application, latchoff mode is highly recommended for maximum level of robustness.
Note: When VOUT is released from a short-circuit condition, it is possible for the output to momentarily exceed the maximum output voltage rating. In cases where repeated shorts are expected, VOUT should be protected by the addition of a 5.6V Zener clamp from VOUT to GND. Alternatively, COUT can be increased to 47F or greater.
Zero-Current Comparator The zero-current comparator monitors the inductor current to the output and shuts off the synchronous rectifier when this current falls below approximately 20mA. This prevents the inductor current from reversing in polarity, thereby improving efficiency at light loads. Anti-Ringing Control The anti-ringing circuit connects a resistor across the inductor to damp the ringing on SW in discontinuous conduction mode. The ringing of the resonant circuit formed by L and CSW (capacitance on the SW pin) is low energy but can cause EMI radiation. Output Disconnect The LTC3529 provides true output disconnect by eliminating body diode conduction of the internal P-channel MOSFET rectifier. This allows VOUT to go to zero volts during shutdown, drawing no current from the input source. It also provides inrush current limiting at turn-on, minimizing surge currents seen by the input supply. Thermal Shutdown If the die temperature reaches approximately 160C, the device enters thermal shutdown, the fault flag is asserted (FAULT pulls low) and all switches are turned off. The device is enabled and a soft-start sequence is initiated when the die temperature drops by approximately 10C. PCB Layout Due to the high frequency operation of the LTC3529, board layout is extremely critical to minimize transients caused by stray inductance. Keep the output filter capacitor as close as possible to the VOUT pin and use very low ESR/ESL ceramic capacitors tied to a good ground plane.
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LTC3529 APPLICATIONS INFORMATION
The basic LTC3529 application circuit is shown in the Typical Application on the front page. The external component selection is determined by the desired output current and ripple voltage requirements of each particular application. However, basic guidelines and considerations for the design process are provided in this section. Output Capacitor Selection A low ESR (equivalent series resistance) output capacitor should be used at the output of the LTC3529 to minimize the output voltage ripple. Multilayer ceramic capacitors are an excellent choice as they have extremely low ESR and are available in small footprints. X5R and X7R dielectric materials are strongly recommended over Y5V dielectric because of their improved voltage and temperature coefficients. Neglecting the capacitor ESR and ESL (equivalent series inductance), the peak-to-peak output voltage ripple can be calculated by the following formula, where f is the , frequency in MHz, COUT is the capacitance in F and ILOAD is the output current in amps. VP -P = ILOAD ( VOUT - VIN ) COUT * VOUT * f Although ceramic capacitors are recommended, low ESR tantalum capacitors may also be used. A small ceramic capacitor in parallel with a larger tantalum capacitor is recommended in demanding applications that have large load transients. Input Capacitor Selection Low ESR input capacitors reduce input switching noise and reduce the peak current drawn from the battery. It follows that ceramic capacitors are also a good choice for input decoupling and should be located as close as possible to the device. A 3.3F input capacitor is sufficient for most applications. Larger values may be used without limitation. Capacitor Vendor Information Both the input and output capacitors used with the LTC3529 must have low ESR and be designed to handle the large AC currents generated by switching converters. The vendors in Table 1 provide capacitors that are well suited to LTC3529 application circuits.
Table 1. Capacitor Vendor Information
MANUFACTURER WEB SITE PHONE FAX Taiyo Yuden TDK Sanyo AVX Murata Sumida www.t-yuden.com www.component. tdk.com www.secc.co.jp www.avxcorp.com www.murata.com www.sales@ us.sumida.com (408) 573-4150 (408) 573-4159 (847) 803-6100 (847) 803-6296 (619) 661-6322 (619) 661-1055 (803) 448-9411 (803) 448-1943 (814) 237-1431 (814) 238-0490 (408) 321-9660 (408) 321-9308
The internal loop compensation of the LTC3529 is designed to be stable with output capacitor values of 6.5F or greater. This complies with USB On-The-Go specifications, which limit the output capacitance to 6.5F In general use of the . LTC3529, the output capacitor should be chosen large enough to reduce the output voltage ripple to acceptable levels. A 6.8F to 10F output capacitor is sufficient for most applications. Larger values up to 22F may be used to obtain extremely low output voltage ripple and improved transient response.
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LTC3529 APPLICATIONS INFORMATION
Inductor Selection The LTC3529 can utilize small surface-mount chip inductors due to its fast 1.5MHz switching frequency. Larger values of inductance will allow slightly greater output current capability by reducing the inductor ripple current. Increasing the inductance above 10H will increase component size while providing little improvement in output current capability. USB On-The-Go specifications limit output capacitance to 6.5F When using a 6.5F output capacitance, a 4.7H . inductor must be used to maintain stability. Larger inductors may be used with larger output capacitors. The minimum inductance value for a given allowable inductor ripple I (in Amps peak-to-peak) is given by: L> VIN(MIN) * VOUT - VIN(MIN) I * f * VOUT PCB Layout Guidelines The LTC3529 switches large currents at high frequencies. Special care should be given to the PCB layout to ensure stable, noise-free operation. Figure 1 depicts the recommended PCB layout to be utilized for the LTC3529. A few key guidelines follow: 1. All circulating current paths should be kept as short as possible. This can be accomplished by keeping the copper traces to all components in Figure 1 short and wide. Capacitor ground connections should via down to the ground plane in the shortest route possible. The bypass capacitors on VIN and VOUT should be placed close to the IC and should have the shortest possible paths to ground. 2. The PGND pin should be shorted directly to the exposed pad, as shown in Figure 1. This provides a single point connection between the small signal ground and the power ground, as well as a wide trace for power ground. 3. All the external components shown in Figure 1 and their connections should be placed over a complete ground plane. 4. Use of multiple vias in the die attach pad will enhance the thermal environment of the converter, especially if the vias extend to a ground plane region on the exposed bottom surface or inner layers of the PCB.
(
) H
where VIN(MIN) is the minimum input voltage, f is the operating frequency in MHz (1.5MHz Typ), and VOUT is the output voltage (5V). The inductor current ripple is typically set for 20% to 40% of the maximum inductor current (IP). High frequency ferrite core inductor materials reduce frequency dependent power losses compared to cheaper powdered iron cores, improving efficiency. To achieve high efficiency, a low ESR inductor should be utilized. The inductor must have a saturation current rating greater than the worst case average inductor current plus half the ripple current. Molded chokes and some chip inductors usually do not have enough core to support peak LTC3529 inductor currents. To minimize radiated noise, use a shielded inductor. See Table 2 for suggested components and suppliers.
Table 2. Representative Surface Mount Inductors
MAX MANUFACTURER PART NUMBER VALUE CURRENT (H) (A) Sumida TDK Coilcraft CDRH5D16NP VLF5014S MSS6122 4.7 4.7 4.7 4.7 2.15 2 1.82 2.3 DCR () 0.064 0.098 0.065 0.043 HEIGHT (mm) 1.8 1.4 2.2 2.5
VOUT 1 SW 2 SHDN 3 PGND 4 MULTIPLE VIAs TO GROUND PLANE
8 VIN 7 RST 6 SNSGND 5 FAULT
Figure 1. LTC3529 Recommended PCB Layout
Cooper Bussmann SD25-4R7
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LTC3529 TYPICAL APPLICATIONS
Li-Ion Battery to 5V at 100mA or 500mA for USB OTG Host Supply
L1* 4.7H 2.5V TO 4.2V
+
Li-Ion
3.3F 1.8V 1M VIN
LTC3529 SW
TO P AUTO-RESTART OFF ON
FAULT SNSGND RST VOUT COUT 6.8F OFF ON SHDN PGND VOUT, 5V
*L1: SUMIDA CDRH5D16NP
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Overcurrent Event VRST High
VOUT 5V/DIV LOAD CURRENT 1A/DIV VOUT 5V/DIV LOAD CURRENT 1A/DIV
Overcurrent Event VRST Low
FAULT 2V/DIV
FAULT 2V/DIV
3529 TA02b
20ms/DIV
20ms/DIV
3529 TA02c
2 Alkaline Cells to 5V at 350mA
L1* 4.7H 1.8V TO 3.2V 100 90 80 VIN 270 SW EFFICIENCY (%) 2-CELL ALKALINE CIN 3.3F LTC3529 70 60 50 40 30 20 10 0 *L1: SUMIDA CDRH5D16NP
3529 TA03a
2 Alkaline Cells to 5V Efficiency
VIN = 3V EFFICIENCY VIN = 1.8V 0.7 0.6 POWER LOSS (W) 0.5 0.4 0.3 VIN = 1.8V POWER LOSS VIN = 3V 1 10 100 LOAD CURRENT (mA) COUT = 6.8F INDUCTOR = 4.7H, COOPER BUSSMANN SD25-4R7 0 1000
3529 TA03b
+
FAULT SNSGND RST VOUT COUT 6.8F VOUT, 5V
AUTO-RESTART OFF ON
0.2 0.1
OFF ON
SHDN
PGND
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LTC3529 PACKAGE DESCRIPTION
DCB Package 8-Lead Plastic DFN (2mm x 3mm)
(Reference LTC DWG # 05-08-1718 Rev A)
0.70 0.05 1.35 0.05 1.65 0.05
3.50 0.05 2.10 0.05
PACKAGE OUTLINE
0.25 0.05 0.45 BSC 1.35 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 2.00 0.10 (2 SIDES) R = 0.115 TYP R = 0.05 5 TYP 0.40 0.10 8
1.35 0.10 3.00 0.10 (2 SIDES) PIN 1 BAR TOP MARK (SEE NOTE 6) 4 0.200 REF 0.75 0.05 1.35 REF BOTTOM VIEW--EXPOSED PAD 0.00 - 0.05 NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 1 1.65 0.10 PIN 1 NOTCH R = 0.20 OR 0.25 x 45 CHAMFER
(DCB8) DFN 0106 REV A
0.23 0.05 0.45 BSC
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Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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LTC3529 RELATED PARTS
PART NUMBER LTC3400/LTC3400B LTC3401 LTC3402 LTC3421 LTC3422 LTC3426 LTC3427 LTC3429/LTC3429B LTC3458/LTC3458L LTC3459 LT3494/LT3494A LTC3525-3/ LTC3525-3.3/ LTC3525-5 DESCRIPTION 600mA (ISW), 1.2MHz, Synchronous Step-Up DC/DC Converter 1A (ISW), 3MHz, Synchronous Step-Up DC/DC Converter 2A (ISW), 3MHz, Synchronous Step-Up DC/DC Converter 3A (ISW), 3MHz Synchronous Step-Up DC/DC Converter with Output Disconnect 1.5A (ISW), 3MHz Synchronous Step-Up DC/DC with Output Disconnect Converter 2A (ISW), 1.5MHz, Step-Up DC/DC Converter 500mA (ISW), 1.25MHz Synchronous Step-Up DC/DC Converter with Output Disconnect 600mA (ISW), 550kHz, Synchronous Step-Up DC/DC Converter with Soft-Start/Output Disconnect 1.4A/1.7A (ISW), 1.5MHz Synchronous Step-Up DC/DC 80mA (ISW), Synchronous Step-Up DC/DC Converter 180mA/350mA (ISW), High Efficiency Step-Up DC/DC Converter with Ouput Disconnect 400mA (ISW), Synchronous Step-Up DC/DC Converter with Output Disconnect COMMENTS 92% Efficiency, VIN: 0.85V to 5V, VOUT(MAX) = 5V, IQ = 19A/300A, ISD <1A, ThinSOTTM Package 97% Efficiency, VIN: 0.85V to 5V, VOUT(MAX) = 5.5V, IQ = 38A, ISD <1A, MS10 Package 97% Efficiency, VIN: 0.85V to 5V, VOUT(MAX) = 5.5V, IQ = 38A, ISD <1A, MS10 Package 94% Efficiency, VIN: 0.85V to 4.5V, VOUT(MAX) = 5.25V, IQ = 12A, ISD <1A, 4mm x 4mm QFN-24 Package 94% Efficiency, VIN: 0.85V to 4.5V, VOUT(MAX) = 5.25V, IQ = 25A, ISD <1A, 3mm x 3mm DFN-10 Package 92% Efficiency, VIN: 1.6V to 5.5V, VOUT(MAX) = 5V, IQ = 600A, ISD <1A, ThinSOT Package 94% Efficiency, VIN: 1.8V to 5V, VOUT(MAX) = 5.25V, IQ = 350A, ISD <1A, 2mm x 2mm DFN-6 Package 96% Efficiency, VIN: 0.85V to 4.3V, VOUT(MAX) = 5V, IQ = 20A, ISD <1A, ThinSOT Package 94% Efficiency, VIN: 0.85V to 6V, VOUT(MAX) = 7.5V/6V, IQ = 15A, ISD <1A, 3mm x 4mm DFN-12 Package 92% Efficiency, VIN: 1.5V to 5.5V, VOUT(MAX) = 10V, IQ = 10A, ISD <1A, ThinSOT Package 85% Efficiency, VIN: 2.3V to 16V, VOUT(MAX) = 38V, IQ = 65A, ISD <1A, 2mm x 3mm DFN-6, ThinSOT Package 94% Efficiency, VIN: 0.85V to 4V, VOUT(MAX) = 3V/3.3V/5V, IQ = 7A, ISD <1A, SC-70 Package 94% Efficiency, VIN: 0.85V to 5V, VOUT(MAX) = 5.25V, IQ = 9A, ISD <1A, 2mm x 2mm DFN-6 Package 94% Efficiency, VIN: 0.7V to 5V, VOUT(MAX) = 5.25V, IQ = 12A, ISD <1A, 3mm x 3mm QFN-16 Package 94% Efficiency, VIN: 0.7V to 5V, VOUT(MAX) = 5.25V, IQ = 12A, ISD <1A, 2mm x 3mm DFN-8 Package 94% Efficiency, VIN: 0.7V to 5V, VOUT(MAX) = 5.25V, IQ = 30A, ISD <1A, 3mm x 3mm QFN-16 Package 94% Efficiency, VIN: 0.7V to 5V, VOUT(MAX) = 5.25V, IQ = 10A, ISD <1A, 2mm x 3mm DFN-8 Package
LTC3526/LTC3526L/ 500mA (ISW), 1MHz Synchronous Step-Up DC/DC Converter with Output Disconnect LTC3526B LTC3527/LTC3527-1 Dual 800mA and 400mA (ISW), 2.2MHz, Synchronous Step-Up DC/DC Converter with Output Disconnect LTC3528 LTC3537 LTC3539 1A (ISW), 1MHz Synchronous Step-Up DC/DC Converter with Output Disconnect 600mA, 2.2MHz, Synchronous Step-Up DC/DC Converter with Output Disconnect and 100mA LDO 2A , 2MHz, Synchronous Step-Up DC/DC Converter with Output Disconnect
ThinSOT is a trademark of Linear Technology Corporation.
3529fa
12 Linear Technology Corporation
(408) 432-1900 FAX: (408) 434-0507
LT 0409 REV A * PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
www.linear.com
(c) LINEAR TECHNOLOGY CORPORATION 2009

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